Effect of lead-free glass on the current transmission method at the Ag/Si interface in crystalline silicon solar cells.

Environmental protection mandates have spurred the widespread adoption of lead-free glass in electronic material adhesion. Glass powder, crucial for solar silver paste, notably affects the ohmic contact at the Ag-Si interface of crystalline silicon solar cells. This study examines how TeO2 content influences the high-temperature flowability and wettability of lead-free Bi2O3-TeO2-based glass powder, alongside the interplay between the glass's thermal properties and interface contact. Additionally, it investigates the Bi2O3-TeO2 ratio's impact on current transmission through the interfacial glass layer. Experimental results show that the synthesized glass powder exhibits superior high-temperature flowability and wettability, with a low contact resistance of 1.5 mΩ cm2 in silver paste applications. This study also proposes an optimal approach for enhancing current transmission through the interfacial glass layer. Consequently, this glass powder is highly valuable for c-Si solar cell silver paste applications, offering novel insights into improving current transmission efficiency.

Effect of Silver Powder Microstructure on the Performance of Silver Powder and Front-Side Solar Silver Paste.

Silver powder, as the primary component of solar silver paste, significantly influences various aspects of the paste's performance, including printing, sintering, and conductivity. This study reveals that, beyond the shape and size of the silver powders, their microstructure is a critical factor influencing the performance of both silver powders and silver pastes in solar cell applications. The growth process leads to the formation of either polycrystalline aggregated silver powder or crystal growth silver powder. Analyzing the performance characteristics of these different microstructures provides guidance for selecting silver powders for silver pastes at different sintering temperatures. Polycrystalline aggregated silver powder exhibits higher sintering activity, with a sintering initiation temperature around 450 °C. The resulting silver paste, sintered at 750 °C, demonstrates a low sheet resistance of 2.92 mΩ/sq and high adhesion of 2.13 N. This silver powder is suitable for formulating silver pastes with lower sintering temperatures. The solar cell electrode grid lines have a high aspect ratio of 0.37, showing poor uniformity. However, due to the high sintering activity of the silver powder, the glass layer dissolves and deposits more silver, resulting in excellent conductivity, a low contact resistance of the silver electrode, a low series resistance of the solar cell of 1.23 mΩ, and a high photoelectric conversion efficiency of 23.16%. Crystal growth silver powder exhibits the highest tap density of 5.52 g/cm3. The corresponding silver paste shows improved densification upon sintering, especially at 840 °C, yielding a sheet resistance of 2.56 mΩ/sq and adhesion of 3.05 N. This silver powder is suitable for formulating silver pastes with higher sintering temperatures. The solar cell electrode grid lines are uniform with the highest aspect ratio of 0.40, resulting in a smaller shading area, a high fill factor of 81.59%, and a slightly higher photoelectric conversion efficiency of 23.17% compared to the polycrystalline aggregated silver powder.

Study on Low-Temperature Conductive Silver Pastes Containing Bi-Based Glass for MgTiO3 Electronic Power Devices.

Low-temperature lead-free silver pastes deserve thorough investigation for sustainable development and application of MgTiO3 ceramics in electronic devices. In this study, a series of Bi2O3-B2O3-ZnO-SiO2-Al2O3-CaO glasses with suitable softening temperatures were prepared via melt quenching using a type of micrometer silver powder formed by silver nanoparticle aggregates. The composite pastes containing silver powder, Bi2O3 glass powder and an organic vehicle were then screen-printed. The effects of glass powder concentration and sintering temperature on the microstructure of the surface interface were also investigated. The results showed that the silver paste for microwave dielectric ceramic filters (MgTiO3) possessed good electrical conductivity (2.28 mΩ/□) and high adhesion (43.46 N/mm2) after medium temperature (670 °C) sintering. Thus, this glass powder has great application potential in non-toxic lead-free silver pastes for metallization of MgTiO3 substrates.

Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell.

Optimizing the performance of front silver paste is of great significance in improving the efficiency of the photoelectric conversion of crystalline silicon solar cells. As a conductive functional phase of silver paste, the structure and performance of silver powder have an important influence on the sintering process of silver paste and the conductivity of silver electrodes. Because of their two-dimensional structure, flake silver powders can effectively increase the contact area with other silver powders and silicon cells before sintering. Additionally, flake silver particles have higher surface energy and sintering activity than spherical silver particles of the same particle size. However, recent research has mainly focused on the influence of the particle size of silver powder. This paper fills the research gap regarding the morphology of silver powders and clarifies the influence of flake silver powders on the performance of silver paste. The influence of the ratio of spherical silver powder to flake silver powder in silver paste on the sheet resistance, adhesion, and specific contact resistivity of silver film after sintering at 800 °C was studied, and the optimal ratio was determined according to a cross-sectional contact picture of the silver film. The results showed that with the increase in the mass fraction of the flake silver powder, the sheet resistance of the sintered silver film gradually increased, the adhesion first increased and then decreased, and the specific contact resistance first decreased and then increased. When the flake silver powder content was 0%, the minimum sheet resistance of the silver film was 2.41 m Ω/☐. When the flake silver powder content was 30%, the maximum adhesion of the silver film was 6.07 N. When the flake silver powder content was 50%, the minimum specific contact resistivity of the silver film was 0.25 Ω·cm2. In conclusion, when the flake silver powder content was 30%, the comprehensive performance of the silver film was the best.

Ag-NPs/MWCNT composite-modified silver-epoxy paste with improved thermal conductivity.

Heat dissipation is a critical issue in high-performance electronics, which needs to be solved, and an electronic paste is a good choice to solve this issue. In this paper, silver nanoparticles/multi-walled carbon nanotube (Ag-NPs/MWCNT) composites were prepared by the chemical process for the modification of electronic pastes. The micromorphology and spectral analysis of the as-prepared Ag-NPs/MWCNT composites indicated that Ag-NPs were uniformly distributed on the MWCNT surfaces with high distribution densities; the average size of Ag-NPs was estimated to be 8.29 nm. The as-obtained Ag-NPs/MWCNT composites were then added to a silver-epoxy paste. Field emission scanning electron microscopy (FESEM), thermogravimetry (TG) and thermal conductivity analyses suggested the incorporation of Ag-NPs/MWCNT composites in the silver-epoxy paste; Ag flakes were better connected by Ag-NPs/MWCNTs, which improved the thermal conductivity of the paste from 0.73 to 0.96 W m-1 K-1. However, more weight loss was observed when Ag-NPs/MWCNTs were incorporated in the silver-epoxy paste. Overall, the addition of Ag-NPs/MWCNTs into the silver-epoxy paste increased the thermal conductivity, which can be applied to high-performance electronics.